The Semiconductor Catapult supports the development, integration and validation of silicon and compound-semiconductor devices, sub-assemblies and application-focused demonstrators for advanced applications.

We offer world-class specialist technologies and expertise all in one company – unique in the UK and one of only a handful in Europe. Our co-located, cross-disciplinary teams in RF, photonics, power electronics, and advanced packaging solve your system-level challenges, all under one roof.

This enables you to de-risk commercialisation and scale with confidence, accelerate your path from concept to real-world applications and products, and plug into technically advanced supply chain processes.

From start ups and SMEs to large companies and consortia, our products are designed to support business to:

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Validate Performance

Access independent, decision-grade high-fidelity characterisation and reliability evidence across power electronics, RF and microwave, and photonics.

Power electronics:

Advanced device, module and system-level characterisation
Electrical, thermal and reliability characterisation
Double Pulse testing

RF & Microwave:

Load Pull testing
DPD testing
RF characterisation and assembly processes

Photonic Integrated Circuits:

Optoelectronic testing
High-speed optical TxRx
Photonics reliability

Accelerate Product Development

Extend customers’ R&D capability through design, modelling, multi-objective optimisation, prototyping, advanced packaging and integration.

Advanced packaging:

Integrated power-electronics, RF, photonics and packaging expertise
Rapid prototyping
Die bonding, wire bonding and hybridisation

Multi-Objective Optimisation:

Multiphysics modelling and digital-twin development
Design, modelling and AI-assisted Multi-Objective Optimisation

RF & Microwave:

Custom PA design
RFFE Design
RF Prototyping

Photonic Integrated Circuits:

PIC design, wafer-level testing and photonic packaging
Custom Process Design Kit (PDK) and Assembly Design Kit (ADK) development

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Build Trusted Systems

Progress from die and subassembly through to sovereign, application-focused hardware and system demonstrators, including our RF PA platforms, solid-state transformer and uLED interconnect demonstrator.

RF PA platforms:

High efficiency and linearity architectures
Satellite, 5G/6G and x-band applications
Reference designs and prototype platforms spanning sub-6 GHz, mmWave and X-band applications, using high-efficiency Doherty and load-modulated balanced-amplifier architectures for 5G/6G, satellite communications and high-power RF systems.

Solid-state transformer:

A modular SiC-based development and validation platform for solid-state transformer cells, high-frequency transformers and power-conversion architectures, supporting future medium-voltage to 800–1500 V DC distribution for AI data centres.

uLED data centre demonstrator:

A development and validation platform for coupling high-density InGaN µLED arrays to optical fibre, combining optical modelling, fibre attachment and high-speed characterisation to demonstrate short-reach interconnects for AI and high-performance computing systems.